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| 您现在的位置： 北京勤诚天地科技有限公司 > 产品展厅 >
紫外激光打标机，非金属激光打标
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| 发布时间：
2020/8/11 15:21:00 |
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电 话： |
86-010-67187966 |
| 传 真： |
86-- |
| 手 机： |
15010398480 |
| 邮 编： |
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| 地 址： |
西城区新街口 |
| 网 址： |
http://qctd1688.cn.vooec.com |
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| 公司名称：北京勤诚天地科技有限公司 |
| 联 系 人：薛哲凯 先生 经理 |
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紫外激光打标机属于激光打标机的系列产品，但其采用 355nm 的紫外激光
器研发而成，该机采用三阶腔内倍频技术。
同红外激光比较，355 紫外光聚焦光斑极小，能在很大程度上降低材料的机
械变形且加工热影响小，因为主要用于超精细打标、雕刻，特别适合用于食品、
医药、化妆品包装材料打标，打微孔，玻璃材料的高速划分及对硅片晶圆进行复
杂的图形切割等应用领域.
硅胶圆片、柔性 pcb板打标，划片；硅晶圆片微孔、盲孔加工；LCD液晶玻璃二维码打标、玻璃器具表面打孔；PCB加工、金属
表面镀层打标、塑胶按键、电子元件、通讯器材、建筑材料、纺织品、聚合物薄膜等材料的打标和表面处理等，
UV laser marking machine is a series of laser marking machine products, but its use of 355nm UV laser, developed by the device, this machine using third-order intracavity frequency doubling technology. Compared with the infrared laser, the 355 ultra-violet focusing spot is very small, which can reduce the mechanical deformation of the material to a great extent, and the processing heat effect is small, because it is mainly used for ultra-fine marking and engraving, particularly suitable for food, medicine, cosmetic packaging materials marking, micro-hole, glass material high-speed division and Silicon Wafer Complex, complex graphics cutting and other applications. Silicone Wafer, flexible PCB marking, scribing; Silicon Wafer micro-hole, blind hole processing; LCD LCD glass two-dimensional code marking, glass surface punching; PCB processing, metal, surface coating marking, plastic keys, electronic component, communication equipment, building materials, textiles, polymer films and other materials marking and surface treatment,
本产品网址：http://www.vooec.com/cpshow_217243328/
手机版网址：http://m.vooec.com/product_217243328.html
产品名称：紫外激光打标机，非金属激光打标 |
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